Introduction of High-speed Carrier Tape Extrusion And Forming Machine
YAOAN High-speed Carrier Tape Extrusion And Forming Machine: Revolutionizing SMD/SMT Packaging
YAOAN’s carrier tape extrusion and forming machine is a cutting-edge system designed for the automated production of plastic carrier tapes used in Surface Mount Device (SMD) and Surface Mount Technology (SMT) packaging. Since its successful development in 2005, this carrier tape extrusion line has become an industry leader, combining single-pass processing with high-speed precision to replace traditional multi-step methods. Below is a detailed breakdown of its technology, workflow, and competitive
Advantages:
Material: Polystyrene (PS) or Polycarbonate (PC).
Purpose: Holds electronic components (e.g., resistors, ICs) in standardized pockets during transport and assembly.
Key Features:
Anti-static/conductive properties (for ESD protection).
Transparency (PC layer) for component visibility.
Dimensional accuracy for automated pick-and-place systems.
ABA Structure: Produces 3-layer sheets for enhanced functionality:
Top/Bottom Layers: Conductive PS (carbon-filled) for static dissipation.
Middle Layer: Transparent PC or PS for visibility and structural integrity.
Single-Layer Option: PS-only tapes for cost-sensitive applications.
Combines five steps into one automated line:
Sheet Extrusion: Melts and forms PS/PC into a flat sheet.
Vacuum Forming: Creates precise component pockets.
Hole Punching: Adds sprocket holes for tape feeding in assembly machines.
Slitting: Cuts wide sheets into multiple narrow tapes.
Winding: Rolls finished tapes into reels.
Tape Output Options:
4/6/8/9-Tape Configurations: Produces 4, 6, 8, or 9 carrier tapes simultaneously from a single sheet.
Linear Speed: Up to 25 meters/minute per tape, enabling high-volume production.
| Parameter | Details |
|---|---|
| Material | PS, PC, or PS/PC coextrusion (ABA structure). |
| Sheet Width | Adjustable based on tape quantity (e.g., 4-tape: ~200 mm). |
| Tape Width | Standard: 8 mm, 12 mm, 16 mm, 24 mm (customizable). |
| Pocket Depth | 0.2–5 mm (adjustable via vacuum forming molds). |
| Production Capacity | 8-tape machine: ~200 m/min total (25 m/min per tape × 8 tapes). |
| Feature | YAOAN Machine | Traditional 2-Step Process |
|---|---|---|
| Process Steps | Single-pass extrusion-forming line. | 1. Sheet extrusion → 2. Secondary forming. |
| Material Waste | Minimal (direct pellet-to-tape conversion). | High (trimming, scrap from secondary steps). |
| Efficiency | 10–20x faster (e.g., 25 m/min vs. 2 m/min). | Slow due to manual handling between steps. |
| Cost | Lower energy, labor, and material costs. | Higher operational and material expenses. |
Electronics Manufacturing: Packaging ICs, resistors, capacitors, LEDs.
Automotive Electronics: ESD-safe tapes for sensors, connectors.
Medical Devices: Precision carrier tapes for micro-components.
High-Speed Precision: Tight tolerances (±0.05 mm) for pocket depth and sprocket hole alignment.
Material Versatility: Handles conductive PS, transparent PC, and blends.
Customization: Adaptable molds for pocket shapes/sizes, slitting widths, and winding formats.
Energy Efficiency: Direct extrusion-forming reduces thermal cycles and energy use.
Raw Material Feeding: PS/PC pellets are fed into the extruder.
Coextrusion: ABA layers are formed via a multi-channel die.
Vacuum Forming: Heated sheet is molded into pockets using precision dies.
Punching & Slitting: Sprocket holes added, and sheet slit into individual tapes.
Winding: Tapes coiled into reels with tension control for smooth handling.
Cost Reduction: Eliminates secondary processing, slashing labor and material waste.
Scalability: Modular design supports small-to-large batch production.
Quality Consistency: Automated controls ensure uniformity critical for high-speed SMT lines.
Summary
YAOAN’s carrier tape extrusion line redefines efficiency in electronics packaging, merging extrusion, forming, hole punching and slitting into a seamless, high-speed process. Its ability to produce 4–9 tapes simultaneously at 25 m/min—coupled with ABA coextrusion for ESD protection and visibility—positions it as the go-to solution for manufacturers seeking to cut costs, boost output, and meet stringent quality standards. By replacing outdated two-step methods, this carrier tape extrusion line exemplifies innovation in industrial automation.
Carrier Tape apply to the IC, SMT semiconductors, crystal and other chip components of the SMD tape packaging. Piezoelectric crystal industry specifications: 49U/SMD, 49S/SMD, UM-1/SMD, UM-5/SMD, SMU7, SMU5, osc half 8045, 7050, 6035, 5.32, 4023, 3225 and other SMT.
carrier Tape specifications:
Thickness: 0.2mm-0.5mm
Carrier tape width range: 5mm-16mmetc.
pocket size: according to client's requirement
deepth of pocket: less than 5mm
Black Conductive PS Sheet for Carrier Tape
RoHS standard
PS sheet or PC co-extrusion Sheet is black carrier tape material with good rigidity and strong toughness
Recommended for packaging of IC electronic components
Yes, we supply detailed user manual for your reference. PLS read it carefully for guide. If there is still problem which could not be solved, PLS contact us, we are ready to help you anytime.
We supply perfect overseas service. We shall send engineers to overseas for machine installation and commissioning and test production guide, and also training to the workers of the buyer. And we are ready to give technical support anytime.
he guarantee period of our machine is 12 months after the machine is installed well in buyer's factory;
Painted the machine with anti-corrosion oil, and then covered with plastic film, and then packed into wooden case or fixed onto wooden pallet as per clients' requirements, or shall be loaded into container with film packing. After fixed all machines, we will use drying agent to keep container inside dry.
